February 16-19, 2019
Prague, Czech Republic
The 8th International Conference on Manufacturing Engineering and Processes
Welcome Message from Conference Chair Prof. Mario Kong
I am pleased to announce that
the 8th International Conference on Manufacturing
Engineering and Processes (ICMEP 2019) will take place in
Masaryk Dormitory, Czech Technical University, Prague,
Czech, from the 16th to the 19th of February of
2019. (Venue Address: (Masarykova kolej-ČVUT) : Thákurova 1, 160 41,
Praha 6, Prague)
ICMEP, is an annual conference organized with the intend of being a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Manufacturing Engineering and Process. This conference provides opportunities for the delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration.
I cordially invite the scientific community to participate in what promises to be a memorable conference. I believe we have chosen a venue that guarantees a successful technical conference amid the culture and scenery of Prague, Czech.
Prague is an attractive city, with an exciting cultural awareness, unique architecture and a warm and welcoming population, all of which make it a very appealing destination.
I look forward to welcoming many professionals in the field of Manufacturing Engineering and Processes from all over the world in February 2019 in Prague.
Prof. Mário S. Ming Kong
Accepted papers will be published
into conference proceedings: Solid State Phenomena (ISSN: 1662-9779), which will be
indexed by EI Compendex, Scopus, SCImago Journal & Country Rank (SJR), Thomson Reuters (WoS), Inspec,et al.
For more information here
Instructions submission can be browsed here. Any further questions or check papers' status, please mail email@example.com.
More information here.
Click the EC
button to submit your full paper or abstract. An
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